SRINAGAR: The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), marking a fresh push to strengthen the country’s chipmaking capacity. Together, the projects will involve investments of about Rs 4,600 crore and are expected to employ 2,034 skilled professionals directly, with additional indirect jobs in the wider electronics ecosystem, according to a PIB handout.
The proposals come from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With this approval, India now has 10 semiconductor projects cleared under ISM, with combined investments of around Rs 1.60 lakh crore spread across six states.
Two of the newly approved facilities — by SiCSem and 3D Glass — will be located in Odisha’s Info Valley, Bhubaneswar. SiCSem, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will set up India’s first commercial compound semiconductor fabrication plant for silicon carbide devices, with an annual capacity of 60,000 wafers and 96 million packaged units. These components will serve sectors such as defence, electric vehicles, railways, solar power, and consumer appliances.
3D Glass Solutions will establish an advanced packaging and embedded glass substrate unit, bringing glass interposer and 3D heterogeneous integration (3DHI) technology to India. The plant will be capable of producing 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, with applications in defence, AI, high-performance computing, automotive, and photonics.
In Andhra Pradesh, ASIP Technologies — in partnership with APACT Co. Ltd. of South Korea — will set up a semiconductor packaging unit with a capacity of 96 million units per year, targeting mobile devices, set-top boxes, and automotive electronics.
Punjab-based Continental Device India Limited will expand its Mohali plant to manufacture high-power discrete semiconductors, including MOSFETs, IGBTs, Schottky bypass diodes, and transistors in both silicon and silicon carbide, with an annual capacity of over 158 million units.
Officials said the projects will help meet India’s rising semiconductor demand in telecom, automotive, data centres, consumer electronics, and industrial systems, while complementing the country’s chip design ecosystem, which already includes over 70 start-ups and 278 academic partners supported under government talent and infrastructure programmes.
